Dimensity 9000: A full analysis

Mediatek has announced their upcoming flagship for next year. They are naming it, the Dimensity 9000.

Earlier in the year, the directors of Mediatek did proclaim that they would have an SoC based on ARMv9 architecture ready before the end of the year. They were not kidding. The Dimensity 9000 beat the offerings from Samsung and Qualcomm to the market.

Now whilst this is very good news, I do not quite understand the jump from Dimensity 1200 to Dimensity 9000). I am guessing that this name change has been effected to reflect the move from ARMv8 to ARMv9 but you can never really tell.

The Dimensity 9000 has some next gen specs in it’s arsenal. It has taken full advantage of it’s ARM license to bring the power of next gen computing to its new flagship SoC.

 Specs
CPU cores1 Cortex X2 (3GHz)
3 Cortex A710 (2.85GHz)
4 Cortex A510 (1.8GHz)
GPUMali G710
ArchitectureARMv9
MemoryLPDDR5X RAM (7500Mbps)
ISP3X MTK ISP (18-bit HDR)
APU 5.0
Max camera support320MP
Video capability4K HDR on 3 cameras
Super night video recording
Display supportFHD+ @ 180Hz refresh rate
ConnectivityMediatek 5G Modem
DL: 7Gbps
Bluetooth 5.3
Wifi 6

 

Architecture

Although some of the specs of the upcoming Qualcomm flagship have leaked, the Dimensity 9000 is the first official flagship to be released with the ARMv9 architecture. This is actually a big deal. Mediatek which has for so long, struggled behind the like of Qualcomm and Samsung has actually beaten them to the market. ARMv9 promises a lot of great stuff, you can read about it here.

Build process

This is also the first SoC to be built on a 4nm process. No one else has done it before. As every smartphone tech enthusiast will tell you, the smaller the build process, the cooler and more effective an SoC will run.

CPU core

The CPU cores which are the main computing hub of the SoC have under gone a massive upgrade from the A78 (1) + A78 (3) + A55 (4) setup to a more modern X2 (1) + A710 (3) + A510 (4). This should see some serious computing power upgrades here.

GPU

As usual, the Dimensity 9000 is paired with an ARM Mali G710 flagship GPU. This GPU is said to have ray tracing technology. The same ray tracing technology that Samsung and AMD were touting on the Exynos 2200.

Memory

For memory tasks as well as multitasking, there will be an LPDDR5x RAM that can handle data of up to 7500Mbps. This means that you can leave a lot of apps in the background and not worry about them closing up.


 

ISP

The image signal processor here is not exclusively named but it is a triple ISP that supports 18-bit HDR data encoding. It will work alongside the latest AI module known as APU 5.0. Mediatek usually uses Da Vinci NPUs so this could be one of them as well.

Camera/Video

This SoC supports camera resolutions of up to 320MP. This is the most that I have ever seen on any SoC. Even SD888+ and Exynos 2100 support a maximum of 200MP. As for the video department, they are able to match the 4K HDR benchmark set by the other giants of the industry but they fall short of the 8K video requirement.

Display

In the display department, this SoC is very underwhelming as it can only support FHD+ screens. On the plus side, those FHD+ displays can hit up to 180Hz in refresh rate speeds.


Connectivity

THis SoC is 5G ready but also support existing 4G networks. With most countries shutting down their 2G and 3G networks, I am guessing that 4G/5G connectivity are all an SoC needs. Mediatek did not name the modem that is on board, but I’ll take a guess and say it is the Mediatek Helio M70. In addition to these, it also supports Bluetooth 5.3 and WiFi 6.


Final take

The Dimensity 9000 promises to be a very powerful SoC, especially in terms of processing power. It looks powerful enough to rub shoulders with the Snapdragon 898 and the Exynos. That being said, in the camera department however, the Dimensity 9000 still has a long way to go. In the network department, this SoC is well equipped for the job but don’t look to this SoC for camera performance.


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